Sample & small-scale processing

Items	Parameters
Maximum Multilayer	1-30
PCB Laminate type	FR-4
Maximum board size	50cm X 110cm
Shape Dimension Accuracy	± 0.2mm
Material Thickness range	0.40mm--2.4mm
Board thickness tolerance	± 10%(t ≥ 0.8mm)
Board thickness tolerance	± 10%(t＜0.8mm)
Medium thickness	0.075mm--5.0mm
Minimum line width	6mil
Minimum spacing	6mil
Outer layer copper thickness	35um
Inner layer copper thickness	17um--100um
Drill Diameter (Mechanical)	0.3mm--6.35mm
Hole Diameter (Mechanical)	0.3mm--6.30mm
Hole Tolerance (Mechanical)	0.08mm
Hole Position Tolerance	0.09mm
Board Thickness and Aperture Ratio	8:1
Solder mask type	photosensitive ink
Minimum Solder Bridge Width	0.1mm
Minimum Solder Isolation Ring	0.1mm
Plug hole diameter	0.25mm--0.60mm
Solder mask hardness	6H
Solderability s/m	245℃ /5S
Quality spec	GB/T.4588,IPC-A-600F(single sided) IPC-A-600F,IPC-ML-950(Multilayer)
surface plating	Immersion tin, Immersion gold, Galvanic Gold

PCB Layer：	1(single side) 2(double side) 4(Multi-layer)
Laminate type：	FR-4
PCB Length：	PCB Width：(Unit:mm)
PCB Qty：
PCB Shape：	rectangular circular irregular shape
Multiple pcb panelized：	1 2 3
Silkscreen layer：	white (only)
PCB board thickness：	0.4 0.6 0.8 1 1.2 1.6 2.0 (mm)
Solder mask layer：	green blue yellow black red white
Minimum Drill tools：	(Max: 6.3mm)
Surface plating：	Immersion tin(lead) Immersion tin(no tead) Immersion gold
Pcb through Hole：	Paint covering Paint not covering
Flying Probe Test：	Test half All test Not test
Shipping：	Ari parcel(Hongkong) DHL EMS
Payment：	Paypal Bank
Validation code：

Pcb manufacturing